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The X950 is the first in the VT series to support clean rooms for mid-process semiconductors where wafer-to-wafer bonding processes occur.
The VT-X850 utilises Omron's proven 3D CT technology to deliver high-quality X-ray inspection results for heavy and thick samples.
The X750 is used for non-destructive inspection of 5G infrastructure/modules and in-vehicle electrical components
The VT-S530 provides Full 3D-AOI capability, high performance, highest first pass yield, zero escape and lowest false rejects amongst other strengths.
Achieved high-speed, high-precision, and high-efficiency in AOI with Omron's proprietary imaging technique, combining both speed and accuracy.
OMRON Inspection Systems offer top-quality AOI, SPI, and AXI solutions with advanced imaging and machine learning to detect defects in electronics manufacturing.