Learn more ⇾
The X950 is the first in the VT series to support clean rooms for mid-process semiconductors where wafer-to-wafer bonding processes occur.
The VT-X850 utilises Omron's proven 3D CT technology to deliver high-quality X-ray inspection results for heavy and thick samples.
The X750 is used for non-destructive inspection of 5G infrastructure/modules and in-vehicle electrical components
OMRON’s 3D AXI Systems use advanced imaging to detect internal defects in electronic assemblies, ensuring top-quality standards.