Vanstron’s High-Temperature Vertical Oven is engineered to meet the most rigorous requirements of modern electronics manufacturing, offering precise and reliable performance up to 200 degree . Designed for high-demand applications, this oven provides exceptional thermal uniformity, durability, and energy efficiency in a compact, space-saving vertical design.
Application
- PCB Thermal Processes: High-temperature curing of solder paste, coatings, adhesives, and encapsulants.
- SMT Assembly: Seamless integration for inline or standalone operations.
- High-Performance Electronics Manufacturing: Suitable for advanced components requiring elevated thermal stability
The vertical buffer oven system not only offers ideal drying and hardening processes, it is also extremely compact and space-saving thanks to its design. As a result of the vertical transport, the system replaces, with a system length of only around 2.35 m, a comparable 40 m long horizontal furnace. With the innovative system design, you can save valuable space in your production hall.
Flexible transport width, where the transport by means of circulating goods carriers is automatically set to the respective circuit board size. Several coating lines can therefore feed different products with varying circuit board transport widths into the system. With the vertical buffer oven, printed circuit boards with a maximum height of 50 mm can be dried.